CMP, also called thermal oxidation sharpening, utilizes MP in conjunction with substances to enhance the MRR and increase surface area good quality [20]. Figure two illustrates the schematic of a standard CMP process [21]. The SiC wafer, and that is fastened about the carrier, and the sprucing pad go relative https://www.facebook.com/permalink.php?story_fbid=pfbid0jruk29rJLHhQJtn1712QVSYDcitHcsRhiQcJ3xDRxWbjyj1eTJZxpg7UF3ku7zzYl&id=61560512640678&__cft__[0]=AZVVqPnE3GcEj7g0JETodizsaICjDgtVVjfT1f-OZX4AaNh6VkZkj0PlqKUFIr5ud_w0d6UAsndYvIiuDdOdCa4GknMjEFg9bLqOi_hZZ4-Zdq8Evabs6kyPzF5xCtxSDVrvaKggRK6bWk-PddsOKG4ZoZe3MgWbSZGBVkJerSx-nluTrPWkBGIlmUvTjnZMgC6_W32ZLO94UWBg9XhT3b9G&__tn__=%2CO%2CP-R